Myung Jae Lee

PostDoc at the Applied Quantum Architectures Group of the Faculty of Engineering, Mathematics and Computer Science (EEMCS/EWI), Delft University of Technology.

Projects

Ultra-Low-Noise SPAD in Deep-Submicron CMOS Technology for LiDAR

Samsung Advanced Institute of Technology                                                                       Sep. 2015 – Present

● Development of ultra-low-noise SPADs in deep-submicron CMOS technology for LiDAR

● Design and performance characterization of SPADs

● Coordination and management of the project

  

L3SPAD: A Single-Photon, Time-Resolved Image Sensor for Low-Light-Level Vision

HTSM (High Tech Systems and Materials), The Netherlands                                                 Jun. 2015 – Present

● Development of new high-performance SPADs in CMOS technology for low-light-level vision image sensors and applications

● Investigation on low dark count rate and high fill factor of SPADs

● Coordination and management of the project

 

POLIS: Pilot Optical Line for Imaging and Sensing

ENIAC Joint Undertaking (JU)                                                                                 Jan. 2014 – Present

● Design and characterization of TOF CMOS imagers based on dedicated SPADs

● Development of photon counting sensor matrix for Gamma-/X-ray detection and advanced microscopy

● Coordination and management of the project

 

SOLO3: Three-Dimensional CMOS Photon Counting for Medical Imaging and Cancer Diagnostics

HTSM (High Tech Systems and Materials), The Netherlands                                                Aug. 2013 – Present

● CMOS backside-illuminated (BSI) SPAD development and characterization

● 3D stacking method test and characterization

● Coordination and management of the project

 

Non-Invasive High Resolution Near-Infrared Imaging for Hemodynamics Monitoring and Tumor Detection

Samsung Global Research Outreach (GRO)                                                                     Aug. 2013 – Dec. 2014

● Performance evaluation of SPADs for non-invasive high resolution near-infrared imaging

 

 

Research

● Research and development of high-performance single-photon detectors & sensors based on SPADs (single-photon avalanche diodes) for next-generation applications (e.g. LiDAR (light detection and ranging), ADAS (advanced driver assistance system), autonomous vehicles, drones/robots, machine vision, PET (positron emission tomography), FLIM (fluorescence-lifetime imaging microscopy, NIRI (near-infrared imaging), etc.)

 ● Development and optimization of silicon-photonics devices (e.g. silicon-based high-performance photodetectors, modulators, etc.) for optical-interconnect applications (e.g. rack-to-rack interconnects within data centers and computer clusters, chip-level interconnects, vehicular communications, home networks, etc.)

 

 

Publications

Myung-Jae Lee, Pengfei Sun, and Edoardo Charbon, “A First Single-Photon Avalanche Diode Fabricated in Standard SOI CMOS Technology With a Full Characterization of the Device,” Optics Express, vol. 23, no. 10, pp. 13200-13209, May 2015. IF = 3.488.

Myung-Jae Lee and Edoardo Charbon, “Towards 3D Integration of Single-Photon Avalanche Diodes with Standard SOI CMOS Technology,” EU-Korea Conference on Science and Technology, Jul. 27-30, 2016, Berlin, Germany.

Myung-Jae Lee, Ivan Michel Antolovic, Arin Can Ulku, and Edoardo Charbon, “A Single-Photon, Time-Resolved Image Sensor for Low-Light-Level Vision,” ICT.OPEN, Mar. 22-23, 2016, Amersfoort, The Netherlands.

Ryota Oyamada, Dali Zhang, Myung-Jae Lee, Edoardo Charbon, and Masahiro Akiyama, “Evaluation of the Three-Dimensional Mounting of the Integrated Circuit Using ACP,” Technical College Symposium, Jan. 23, 2016, Kagawa, Japan.

Myung-Jae Lee, Pengfei Sun, and Edoardo Charbon, “Characterization of Single-Photon Avalanche Diodes in Standard 140-nm SOI CMOS Technology,” International Image Sensor Workshop, Jun. 8-11, 2015, Vaals, The Netherlands.

Masahiro Akiyama, Dali Zhang, Myung-Jae Lee, and Edoardo Charbon, “Evaluation of Resistance for Chip on Chip Bonding Using "AlSi/TiN" Bumps with ACP,” The Japan Society of Applied Physics Spring Meeting, Mar. 11-14, 2015, Tokyo, Japan.

Myung-Jae Lee, Woo-Young Choi, and Edoardo Charbon, “Linear-Mode Avalanche Photodiodes in Standard CMOS Technology (Invited Paper),” International Conference on Optoelectronics and Microelectronics Technology and Application, Nov. 12-14, 2014, Tianjin, China.

 

much more papers can be found in the links below.

 

 

Myung Jae Lee